Miami Zynq Plus - SoC-FPGA Module

Maximum throughput for data acquisition products

The Miami System on Module (SoM) is based on the Xilinx Zynq-7035/7045/7100 System on Chip (SoC). The module combines a high performance (ARM-based) application microprocessor with FPGA logic in a single chip.

It integrates all system components required to bring the system alive including memory, power supply, debugging facilities and various connectivity options. It is a suitable platform for phased array ultrasound and radar applications, which require effective processing power, high speed communication and software defined radio. The SoM has the ability to customize system interfaces and perform real-time signal acquisition. It comes with a aTOPIC supported Linux distribution, including a reference FPGA design.

The Miami combines most FPGA features on 85mmx68.5mm footprint, the board-to-board interconnect is implemented by using two high-quality connectors which expose 240pins, one high-quality connector which expose 180pins and 3pins connector for external Fan. The SoM is available in both the commercial temperature range 0°C...+70°C as well as in the industrial temperature range -40°C....+85°C.

  • Miami Zynq Plus 
    • XC7035
      275KLE, 900  DSP Blöcke, 17.6Mbit RAM, 343,800 FlipFlops, 16x10.3125Gb/s GTX tranceivers
    • XC7045
      350KLE, 900  DSP Blöcke, 19.1Mbit RAM, 437,200 FlipFlops, 16x10.3125Gb/s GTX tranceivers
    • XC7100
      444KLE, 2020  DSP Blöcke, 26.5Mbit RAM, 554,800 FlipFlops, 16x10.3125Gb/s GTX tranceivers
  • Processor System
    • ARMCortex-A9 (Dual-Core)
    • 2x800MHz CPU Perfomance
    • Co-Processor 2xARM NEON
  • 1 GB DDR3/DDR3L RAM (connected to FPGA)
  • 1 GB DDR3/DDR3L RAM (connected to CPU)
  • 64 MB 2xQuad SPI NOR
  • 7 KB EEPROM (3KB secure storage, 4KB normal storage)
  • Processor-Peripherals
    • UART
    • CAN
    • I2C
    • SPI
    • USB 2.0 OTG
       
    • 1000Mbps Ethernet
    • 8xPCIe GEN2
    • SATA-3
  • User programmable/configurable Interfaces
     
    • 49x + 47 + 48 configurable 1V8, 2V5 and 2V3 user I/O (HR)
    • 48x configurable user I/O (HP)
    • 28xPS controlled 1V8 I/O (MIO)
    • 16xSATA-2/3
    • 16x 40GB Ethernet
    • 16x USB 3.0
    • 16xPCIe GEN3/4
    • 16xCoaXPress
    • 16xHDMI
  • Clock distribution
  • single 15V/3A supply
  • size 85mmx68,5mm
  • 2 x 120 pins + 1x180 pins Samtec board-to-board interconnect + 3 pins connector for external Fan
Miami Zynq XC7Z035 - mia-7z35-2-2-3

XC7Z035-FFG900-2

  • ARMCortex-A9 (Dual-Core)
  • 1 GB DDR3/DDR3L RAM (connected to FPGA)
  • 1 GB DDR3/DDR3L RAM (connected to CPU)
  • 64 MB 2xQuad SPI NOR
  • 7 KB EEPROM
  • size 85mmx68,5mm
  • 2 x 120 pins + 1x180 pins Samtec board-to-board interconnect + 3 pins connector for external Fan
  • -40°C...+85°C

 

Miami Zynq XC7Z045 - mia-7z45-2-2-3

XC7Z045-FFG900-2

  •  
    • available on request
  • ARMCortex-A9 (Dual-Core)
  • 1 GB DDR3/DDR3L RAM (connected to FPGA)
  • 1 GB DDR3/DDR3L RAM (connected to CPU)
  • 64 MB 2xQuad SPI NOR
  • 7 KB EEPROM
  • size 85mmx68,5mm
  • 2 x 120 pins + 1x180 pins Samtec board-to-board interconnect + 3 pins connector for external Fan
  • -40°C...+85°C

 

Miami Zynq XC7Z100 - mia-7z10-2-2-3

XC7Z100-FFG900-2

  • ARMCortex-A9 (Dual-Core)
  • 1 GB DDR3/DDR3L RAM (connected to FPGA)
  • 1 GB DDR3/DDR3L RAM (connected to CPU)
  • 64 MB 2xQuad SPI NOR
  • 7 KB EEPROM
  • size 85mmx68,5mm
  • 2 x 120 pins + 1x180 pins Samtec board-to-board interconnect + 3 pins connector for external Fan
  • -40°C...+85°C

 

 

High Flexibility

Maximum flexibility for using the SoM  with 'exotic' interface requirements. Combining standard IP cores like i.e. SPI, USB, UART, Ethernet, CAN, serial, I²C, SPI, etc, unique SoM configurations can be used. Benefit from the variety of freely available IP-cores, or, create your own.

Miami Xilinx Zynq-7035/7045/7100 MPSoC supports DYPLO - dynamic process loader.

Balance

It is a highly integrated and compact off-the-shelf solution for today’s high-performance embedded systems. Miami provides a best in class platform for balancing performance, low cost and power, making a perfect solution for applications that require high processing power, high speed interfaces, a high level of reliability, the ability to optimize system interfaces, and perform real-time analytics and control.

Target Markets

Typical application areas are any existing applications that use an applications processor together with an FPGA, including but not limited to (secure) communications, aerospace & defense, audio / video applications, medical and industrial imaging.

Maximum throughput for data acquisition products