MSRZG3S - Cortex-A55/Cortex-M33

RZ/G3S Smallest SoM Gateway Solution

MSRZG3S SoMs are starting at EUR 35,00 net.

The MSRZG3S is the System-In-Package based on Renesas RZ/G3S Family architecture offering high-performance Cortex-A55/dual Cortex-M33 core. The MSRZG3S combines compact design and a wide range of services, bringing low power consumption, thermal efficiency and low-cost to embedded systems. The MSRZG3S was designed to meet the specification of the OSM-standard as much as possible.

The RZ/G3S general-purpose microprocessor units (MPUs) are built around a Cortex-A55/dual Cortex-M33 CPU core. Peripheral functions include support for multiple interfaces, such as two USB 2.0 channels, Gigabit Ethernet channel, PCI Express, two SD channels, and CAN channel, making it ideal for gateway and IOT- applications.

In addition to a wide range of services, the MSRZG3S module also offers new functionalities in terms of flexibility and processing. The Systems-in-Packages can be individually adapted to the respective customer requirements due to four different form factors.

  • single Cortex-A55, up to 1.1GHz
  • dual Cortex-M33, up to 250MHz
  • 512MB – 2GB LPDDR4 RAM
  • 4GB eMMC NAND Flash
  • dual 10/100/1000MBit Ethernet
  • PCIe Gen2 x1
  • USB2.0 Host/OTG
  • 2x CANFD
  • UART, I2C, SPI
  • ADC
  • compliant to the SGET OSM standard
  • size S, 30x30mm²
  • pin count: 332
  • commercial (-25°C...+85°C) / industrial (-40°C...+85°C) temperature range

MSRZG3S-A0A

  • RZ/G3S CPU
  • R9A08G045S33GBG
  • 512MB LPDDR4 SDRAM
  • No eMMC NAND Flash
  • 128MBit SPI NOR
  • -25°C..+85°C


MSRZG3S-BAA

  • RZ/G3S CPU
  • R9A08G045S33GBG
  • 1GB LPDDR4 SDRAM
  • 4GB eMMC NAND Flash
  • 128MBit SPI NOR
  • -25°C..+85°C

 

OSM Standard          

OSM Standard

The idea of all Open Standard Modules (OSM) is to create a new, future proof and versatile standard for small-size, low-cost embedded computer modules, combining the following key characteristics:

  • different architectures available on the same footprint, scalability in function and performance
  • four different mechanical sizes and pin counts, downwards compatible
  • pre-defined soft- and hardware interfaces
  • specification and design guide publicly available
  • design support for baseboard integration, driver development and mass production by ARIES Embedded
  • directly assembly to the baseboard without connectors using LGA (Land Grid Array) technology
  • completely machine processible during soldering, assembly and testing

The Open Standard Module specification allows developing, producing and distributing embedded modules for the most popular MCU32, ARM and RSICV architectures. For a growing number of IoT applications this standard helps to combine the advantages of modular embedded computing with increasing requirements regarding costs, space and interfaces.

RZ/G3S Smallest SoM Gateway Solution